IC packaging is the essential technology that distributes electrical signals from a silicon chip onto the printed circuit board via different types of interconnection methods while provides protection against environmental stresses. A variety of IC packaging technologies is available from Kaynes Semicon to meet numerous end product requirements, including low profile, small foot-print, light weight, efficient thermal dissipation, and better performance in electrical properties and reliability.

Kaynes Semicon partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly.